Zobrazeno 1 - 10
of 10
pro vyhledávání: '"沈建国"'
Publikováno v:
Natural Gas Industry; 2023, Vol. 43 Issue 7, p63-71, 9p
Publikováno v:
Journal of Shanghai Physical Education Institute / Shanghai Tiyu Xueyuan Xuebao; 2022, Vol. 46 Issue 6, p52-93, 10p
Autor:
沈建国
Publikováno v:
Journal of Tianjin University of Sport / Tianjin Tiyu Xueyuan Xuebao; 2022, Vol. 37 Issue 4, p475-481, 7p
Publikováno v:
Transactions of the Chinese Society of Agricultural Engineering. Mar2016, Vol. 32 Issue 5, p245-250. 6p.
Publikováno v:
Journal of Agricultural Resources & Environment / Nongye Ziyuan yu Huanjing Xuebao; Jan2019, Vol. 36 Issue 1, p115-120, 6p
Autor:
王灵东 Wang Lingdong, 吴龟灵 Wu Guiling, 沈建国 Shen Jianguo, 胡亮 Hu Liang, 李新碗 Li Xinwan, 陈建平 Chen Jianping
Publikováno v:
Acta Optica Sinica. 35:0406004
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::525e30b451e65714a8af0e9b30160b71
https://doi.org/10.3788/aos201535.0406004
https://doi.org/10.3788/aos201535.0406004
Publikováno v:
Journal of Shanghai Jiaotong University (Medical Science); Dec2016, Vol. 36 Issue 12, p1768-1771, 4p
Autor:
Shen Chien-Kuo, 沈建國
89
The purpose of the study was to investigate the effect of health-related physical fitness including the BMI, sit and reach, standing boarding jump, 1-min sit-up, 800m run on primary school kids after a nine-week of new program of calisthenics
The purpose of the study was to investigate the effect of health-related physical fitness including the BMI, sit and reach, standing boarding jump, 1-min sit-up, 800m run on primary school kids after a nine-week of new program of calisthenics
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/34810401195667978266
Autor:
Sheen, J. G., 沈建國
86
Indium and its alloys exhibit good service life and reliability, and are well suited for applications such as solder interconnections in electronic packaging. In this study, two types of Au-In microjoints, i.e. Au/In/Au in which In foil was u
Indium and its alloys exhibit good service life and reliability, and are well suited for applications such as solder interconnections in electronic packaging. In this study, two types of Au-In microjoints, i.e. Au/In/Au in which In foil was u
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/68652591054165627169