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pro vyhledávání: '"楊挺立"'
Autor:
Ting-Li Yang, 楊挺立
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With the requirement for decreasing packaging size and increasing quantity for interconnect efficient, flip chip package has become a predominant technology for CPU and GPU…The miniaturization of bump pitch always accompany the rise of inte
With the requirement for decreasing packaging size and increasing quantity for interconnect efficient, flip chip package has become a predominant technology for CPU and GPU…The miniaturization of bump pitch always accompany the rise of inte
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/81318046475094316762
