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pro vyhledávání: '"楊富寶"'
Autor:
Fu-Pao Yang, 楊富寶
89
The research is using the plasma and metal sputter to treat the FR4 and PTFE substrate. Etch the copper foil and pertreatment. Than lamination the 1080 prepreg and RCC. The least etch the surface. To discuss relation of the roughness and peel
The research is using the plasma and metal sputter to treat the FR4 and PTFE substrate. Etch the copper foil and pertreatment. Than lamination the 1080 prepreg and RCC. The least etch the surface. To discuss relation of the roughness and peel
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/45287893328968364671
