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pro vyhledávání: '"楊寅鑪"'
Autor:
Yang,Yen-Lu, 楊寅鑪
107
This paper is for the wire bonding technology of IC packaging industry research. Base on the research of metal wire material components and the study of wire bonding parameters, the silver alloy wire were designed to meet the requirements of
This paper is for the wire bonding technology of IC packaging industry research. Base on the research of metal wire material components and the study of wire bonding parameters, the silver alloy wire were designed to meet the requirements of
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/h9w843
