Zobrazeno 1 - 1
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pro vyhledávání: '"林仕國"'
Autor:
Shih-Kuo Lin, 林仕國
106
This study focuses on the BGA products in the packaging industry (BGA, CSP, ...), which can be further classified into PBGA, EDHS-BGA, and Flip Chip Page. This thesis presents issues and solution faced by packaging techniques in various fabr
This study focuses on the BGA products in the packaging industry (BGA, CSP, ...), which can be further classified into PBGA, EDHS-BGA, and Flip Chip Page. This thesis presents issues and solution faced by packaging techniques in various fabr
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/g7m39m
