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pro vyhledávání: '"枋明輝"'
Autor:
Ming-hui Fang, 枋明輝
97
Chemical mechanical planarization (CMP) process is an important technology to achieve overall planarization in integrated circuit (IC) fabrication process. However, there are some problems including residual stress, scratch and post CMP-clean
Chemical mechanical planarization (CMP) process is an important technology to achieve overall planarization in integrated circuit (IC) fabrication process. However, there are some problems including residual stress, scratch and post CMP-clean
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62857437638010261147
