Zobrazeno 1 - 7
of 7
pro vyhledávání: '"杨文芳"'
Publikováno v:
Chinese Journal of Drug Abuse Prevention & Treatment. 2024, Vol. 30 Issue 3, p458-483. 5p.
Publikováno v:
Zhongguo cuzhong zazhi, Vol 17, Iss 8, Pp 829-833 (2022)
目的 研究高海拔地区缺血性卒中患者单核细胞/HDL-C比值（monocyte/HDL-C ratio，MHR）与颅内动脉粥样硬化性狭窄（intracranial atherosclerotic stenosis，ICSA）程度的相关性。 方法 回顾性连续纳入2017年6
Externí odkaz:
https://doaj.org/article/18db7d1f3e8a4e8db82f09ec0335ccdc
Publikováno v:
Chinese Journal of Osteoporosis. Dec2014, Vol. 20 Issue 12, p1402-1406. 5p.
Publikováno v:
Tianjin Medical Journal; 2019, Vol. 47 Issue 3, p269-273, 5p
Autor:
Wen-Fang Yang, 楊文芳
97
This thesis analyses the stress of IC chip bumps under pressure and heat loading during the thermo-compression bonding in the process of Chip On Glass (COG). The bumps stress and distributions will directly influence to the deformation of con
This thesis analyses the stress of IC chip bumps under pressure and heat loading during the thermo-compression bonding in the process of Chip On Glass (COG). The bumps stress and distributions will directly influence to the deformation of con
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/71098217511277621928
Autor:
Wen-Fang Yang, 楊文芳
97
This thesis analyses the stress of IC chip bumps under pressure and heat loading during the thermo-compression bonding in the process of Chip On Glass (COG). The bumps stress and distributions will directly influence to the deformation of con
This thesis analyses the stress of IC chip bumps under pressure and heat loading during the thermo-compression bonding in the process of Chip On Glass (COG). The bumps stress and distributions will directly influence to the deformation of con
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/72627059247633553965