Zobrazeno 1 - 10
of 132
pro vyhledávání: '"李釗"'
Autor:
Lee, Jhao-Hao, 李釗豪
104
We use E-beam lithography and Photo lithography to make slim FM/Normal metal heterostructures.Microwave signal entered by microstrip or coplanar waveguide (CPW）and we success measure ferromagnetic resonanceand (FMR) signal. When FM/Normal
We use E-beam lithography and Photo lithography to make slim FM/Normal metal heterostructures.Microwave signal entered by microstrip or coplanar waveguide (CPW）and we success measure ferromagnetic resonanceand (FMR) signal. When FM/Normal
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/85937807465632207954
Autor:
Jhao-Syu Li, 李釗旭
102
Recently, the fast development of the computer game industry makes the computer game being one of the major leisure activities of the human being. On the other hand, the applications of artificial intelligence in computer games are notable,
Recently, the fast development of the computer game industry makes the computer game being one of the major leisure activities of the human being. On the other hand, the applications of artificial intelligence in computer games are notable,
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/89487194638959832405
Publikováno v:
Journal of Nanjing University of Information Science & Technology (Natural Science Edition) / Nanjing Xinxi Gongcheng Daxue Xuebao (ziran kexue ban). Sep2024, Vol. 16 Issue 5, p667-677. 11p.
Publikováno v:
Science Technology & Engineering; 2024, Vol. 24 Issue 23, p9729-9736, 8p
Autor:
Chao-ching Li, 李釗慶
94
In a chemical-vapor deposition chamber used for semiconductor fabrication, generally the gas storage and supply system is at atmospheric pressure, but the chamber pressure could be lower than atmospheric pressure, even is lower than thousand
In a chemical-vapor deposition chamber used for semiconductor fabrication, generally the gas storage and supply system is at atmospheric pressure, but the chamber pressure could be lower than atmospheric pressure, even is lower than thousand
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/99392736120163708394
Publikováno v:
Acta Materiae Compositae Sinica; Jun2024, Vol. 41 Issue 6, p2761-2774, 14p
Publikováno v:
Hazard Control in Tunnelling & Underground Engineering. Mar2022, Vol. 4 Issue 1, p55-62. 8p.