Zobrazeno 1 - 10
of 25
pro vyhledávání: '"李瑞芬"'
Autor:
Rui Fen Lee, 李瑞芬
107
The objective of The Trend of Xiequ during Wei, Jin, Southern and Northern Dynasties is to explore the xiequ phenomenon during this era and its contributing factors. As the western humor theories is already well developed, they are able to p
The objective of The Trend of Xiequ during Wei, Jin, Southern and Northern Dynasties is to explore the xiequ phenomenon during this era and its contributing factors. As the western humor theories is already well developed, they are able to p
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/j4h7e4
Publikováno v:
Agricultural Outlook (1673-3908). 10/1/2023, Vol. 19 Issue 10, p109-114. 6p.
Publikováno v:
Agricultural Outlook (1673-3908). 10/1/2023, Vol. 19 Issue 10, p103-108. 6p.
Autor:
Lee, Ray Fen, 李瑞芬
經營管理碩士學程(EMBA)
96
96
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/36898171361356720962
Autor:
Lee, Jui Fen, 李瑞芬
95
Every enterpriser is confronted with severer challenges in the global market nowadays, such as shorter life cycle of products and higher competitions. They have to consistently launch new products and shorten lead time against fast followers.
Every enterpriser is confronted with severer challenges in the global market nowadays, such as shorter life cycle of products and higher competitions. They have to consistently launch new products and shorten lead time against fast followers.
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/08747965350522102728
Autor:
Li, Shui-fun, 李瑞芬
published_or_final_version
toc
Speech and Hearing Sciences
Master
Master of Science in Audiology
toc
Speech and Hearing Sciences
Master
Master of Science in Audiology
Autor:
LEE JUIFEN, 李瑞芬
88
A design of experiment for high throughputs GaAs via etch by reactive ion etch is reported herein. GaAs backside via process for connecting of the front side circuits to the backside ground plane will reduce the ground inductance and thus wil
A design of experiment for high throughputs GaAs via etch by reactive ion etch is reported herein. GaAs backside via process for connecting of the front side circuits to the backside ground plane will reduce the ground inductance and thus wil
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/39755843405695862627
Publikováno v:
Agricultural Outlook (1673-3908). 4/28/2022, Vol. 18 Issue 4, p113-118. 6p.
Publikováno v:
China Brewing; 2023, Vol. 42 Issue 11, p249-253, 5p
Autor:
李瑞芬, Lee, Jui Fen
台灣於1950 年代即開始發展自行車產業，1970 年代挾帶著製造成本優勢以及不斷提升製造技術下，締造了「自行車王國」之美譽，到了1980 年代許多自行車業者紛紛西進和南進，以追求降低生
Externí odkaz:
http://thesis.lib.nccu.edu.tw/cgi-bin/cdrfb3/gsweb.cgi?o=dstdcdr&i=sid=%22G0913590022%22.