Zobrazeno 1 - 4
of 4
pro vyhledávání: '"李亭蓉"'
Autor:
Ting-Rong, Lee, 李亭蓉
105
This is the first study on the physiological values of Formosan black bears and the infection of blood parasites in both bears and the ticks on them. Hematologic and plasma biochemical analyses, blood culture, PCR and gene sequencing were us
This is the first study on the physiological values of Formosan black bears and the infection of blood parasites in both bears and the ticks on them. Hematologic and plasma biochemical analyses, blood culture, PCR and gene sequencing were us
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/c4mse4
Autor:
Ting-Jung Lee, 李亭蓉
101
The previous scholars have pointed out that the sex structure has an impact on the organization operation and performance of organization members. In order to obtain a meaningful research results, the empirical analysis is conducted by means
The previous scholars have pointed out that the sex structure has an impact on the organization operation and performance of organization members. In order to obtain a meaningful research results, the empirical analysis is conducted by means
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/24153976093090958473
Autor:
Ting-Rong Lee, 李亭蓉
99
In view of rapid development of the internet, Facebook has soared all the way to fame since its establishment in 2004 and now it has become world’s leading social networking platform. Therefore, this study is based on the "Fans Page" functi
In view of rapid development of the internet, Facebook has soared all the way to fame since its establishment in 2004 and now it has become world’s leading social networking platform. Therefore, this study is based on the "Fans Page" functi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62273343984925214529
Autor:
Li, Ting-Jung, 李亭蓉
100
3D ICs, which deal with cost-effective achievement by increasing the densities of interconnection between dies, are regarded as an attractive alternative solution for overcoming the bottlenecks on 2D planar ICs. 3D ICs offer the increased sy
3D ICs, which deal with cost-effective achievement by increasing the densities of interconnection between dies, are regarded as an attractive alternative solution for overcoming the bottlenecks on 2D planar ICs. 3D ICs offer the increased sy
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/14193209589924586902