Zobrazeno 1 - 9
of 9
pro vyhledávání: '"朱明慧"'
Autor:
Chu Ming-Hui, 朱明慧
96
In this study, electromigration study in SnCu lead-free solder joints with thin-film under-bump-metallization and Cu substrate pad was conducted. We found that there was sever damage on the substrate side (anode side), and the damage on chip
In this study, electromigration study in SnCu lead-free solder joints with thin-film under-bump-metallization and Cu substrate pad was conducted. We found that there was sever damage on the substrate side (anode side), and the damage on chip
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/92906745573277833040
Publikováno v:
Shandong Medical Journal; 10/25/2024, Vol. 64 Issue 30, p86-88, 3p
Autor:
null 朱明慧
Publikováno v:
水利电力技术与应用. 4:209-211
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f049dfb6806d4541fec3f79f64e7023c
https://doi.org/10.37155/2717-5251-0411-70
https://doi.org/10.37155/2717-5251-0411-70
Publikováno v:
Shandong Medical Journal; 2/15/2023, Vol. 63 Issue 5, p59-62, 4p
Publikováno v:
Journal of International Obstetrics & Gynecology. 2018, Vol. 45 Issue 2, p199-202. 4p.
Autor:
朱明慧
Publikováno v:
Water Conservancy & Electric Power Technology & Application; 2022, Vol. 4 Issue 12, p166-168, 3p
Publikováno v:
Shandong Medical Journal. 1/27/2017, Vol. 57 Issue 4, p66-68. 3p.
Publikováno v:
Practical Pharmacy & Clinical Remedies; 10/1/2017, Vol. 20 Issue 10, p1119-1122, 4p
Publikováno v:
Chinese Journal of Schistosomiasis Control; Feb2017, Vol. 29 Issue 1, p113-115, 3p