Zobrazeno 1 - 10
of 52
pro vyhledávání: '"朱明慧"'
Publikováno v:
Shandong Medical Journal; 10/25/2024, Vol. 64 Issue 30, p86-88, 3p
Publikováno v:
Journal of International Obstetrics & Gynecology. 2018, Vol. 45 Issue 2, p199-202. 4p.
Autor:
null 朱明慧
Publikováno v:
水利电力技术与应用. 4:209-211
Publikováno v:
Shandong Medical Journal; 2/15/2023, Vol. 63 Issue 5, p59-62, 4p
Autor:
朱明慧
Publikováno v:
Water Conservancy & Electric Power Technology & Application; 2022, Vol. 4 Issue 12, p166-168, 3p
Publikováno v:
Shandong Medical Journal. 1/27/2017, Vol. 57 Issue 4, p66-68. 3p.
Autor:
Chu Ming-Hui, 朱明慧
96
In this study, electromigration study in SnCu lead-free solder joints with thin-film under-bump-metallization and Cu substrate pad was conducted. We found that there was sever damage on the substrate side (anode side), and the damage on chip
In this study, electromigration study in SnCu lead-free solder joints with thin-film under-bump-metallization and Cu substrate pad was conducted. We found that there was sever damage on the substrate side (anode side), and the damage on chip
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/92906745573277833040
Publikováno v:
Chinese Journal of Schistosomiasis Control; Feb2017, Vol. 29 Issue 1, p113-115, 3p
Publikováno v:
Practical Pharmacy & Clinical Remedies; 10/1/2017, Vol. 20 Issue 10, p1119-1122, 4p
Publikováno v:
Science & Technology of Food Industry; Jun2024, Vol. 45 Issue 11, p270-279, 10p