Zobrazeno 1 - 2
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pro vyhledávání: '"徐宗本"'
Autor:
Psung-Pen Hsu, 徐宗本
92
Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. The polishing pad is one of the primary consumables in CMP. Extending the life of polishing pad can reduce cost of con
Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. The polishing pad is one of the primary consumables in CMP. Extending the life of polishing pad can reduce cost of con
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/48067216195943006091
Publikováno v:
Acta Scientiarum Naturalium Universitatis Sunyatseni / Zhongshan Daxue Xuebao; Sep2023, Vol. 62 Issue 5, p50-58, 9p
