Zobrazeno 1 - 10
of 53
pro vyhledávání: '"徐 尚"'
Publikováno v:
Chinese Journal of Tissue Engineering Research / Zhongguo Zuzhi Gongcheng Yanjiu. 6/8/2024, Vol. 28 Issue 16, p2587-2592. 6p.
105
Ball grid array becomes popular in advanced electronic package technology due to the demand of thinner and lighter package for 3C electronics. In convention, mechanical punching is the tool used for substrate separation of thin BGA substrate
Ball grid array becomes popular in advanced electronic package technology due to the demand of thinner and lighter package for 3C electronics. In convention, mechanical punching is the tool used for substrate separation of thin BGA substrate
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/9zy3hw
Publikováno v:
Urban Geology; Sep2024, Vol. 19 Issue 3, p365-375, 11p
Publikováno v:
Shanghai Land & Resources / Shanghai Guotu Ziyuan. Mar2023, Vol. 44 Issue 1, p76-81. 6p.
Publikováno v:
Machine Tool & Hydraulics; May2024, Vol. 52 Issue 10, p38-42, 5p
Publikováno v:
Shanghai Land & Resources / Shanghai Guotu Ziyuan. Sep2022, Vol. 43 Issue 3, p30-48. 8p.
Publikováno v:
Chinese Journal of Tissue Engineering Research / Zhongguo Zuzhi Gongcheng Yanjiu; 3/18/2024, Vol. 28 Issue 8, p1229-1234, 6p
Publikováno v:
China Harbour Engineering. 2017, Vol. 37 Issue 3, p66-69. 4p.
Publikováno v:
Feed Research; 2022, Issue 12, p139-143, 5p