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pro vyhledávání: '"彭建元"'
Autor:
Chien-Yuan Peng, 彭建元
106
In recent years, the feature size for IC processes is narrowed down to nanometer level. The narrower feature size for IC processes is, the vulnerable the IC will be. Hence how to improve the yield of wafer production and environment control
In recent years, the feature size for IC processes is narrowed down to nanometer level. The narrower feature size for IC processes is, the vulnerable the IC will be. Hence how to improve the yield of wafer production and environment control
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/nt36yg