Zobrazeno 1 - 6
of 6
pro vyhledávání: '"張鴻志"'
Autor:
Hung-Zhi Chang, 張鴻志
93
The wire bonding process is the key process in an IC chip-package. It is an urgent problem for IC chip-package industry to improve the wire bonding process capability. In this study, an application of artificial neural networks (ANN) and arti
The wire bonding process is the key process in an IC chip-package. It is an urgent problem for IC chip-package industry to improve the wire bonding process capability. In this study, an application of artificial neural networks (ANN) and arti
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/87731192832536559968
Publikováno v:
Guangdong Architecture Civil Engineering; Jan2024, Vol. 31 Issue 1, p60-63, 4p
Publikováno v:
Journal of China University of Petroleum; Dec2023, Vol. 47 Issue 6, p130-137, 8p
Autor:
Hong-Zhi Zhang, 張鴻志
97
The traditional aseismatic design is mainly considered that the building does not collapse under strong ground motion.It uses the safety coefficient to consider people's safety, but possibly to get some problems on displacement or other struc
The traditional aseismatic design is mainly considered that the building does not collapse under strong ground motion.It uses the safety coefficient to consider people's safety, but possibly to get some problems on displacement or other struc
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/64565217704947077911
Publikováno v:
China Textile Leader; Oct2021, Issue 10, p63-66, 4p