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pro vyhledávání: '"張詩汎"'
Autor:
Shih-Fan Chang, 張詩汎
93
The indirect bonding is investigated to bond wafers in various environment with metal interface. By altering parameters, such as annealing time and bonding time. It is found that the effect of wafer bonding varies in different conditions. Two
The indirect bonding is investigated to bond wafers in various environment with metal interface. By altering parameters, such as annealing time and bonding time. It is found that the effect of wafer bonding varies in different conditions. Two
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/pgjmdw
