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pro vyhledávání: '"張照緯"'
Autor:
Chai-Wei Chang, 張照緯
102
Printed circuit board(PCB) is Composite materials, it consists of FR-4, Solder Mask and copper. Because of the Coefficient of thermal expansion(CTE) of each material in PCB are different and Close fit. When PCB in reflow oven with Surface Mo
Printed circuit board(PCB) is Composite materials, it consists of FR-4, Solder Mask and copper. Because of the Coefficient of thermal expansion(CTE) of each material in PCB are different and Close fit. When PCB in reflow oven with Surface Mo
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/54uy4z
