Zobrazeno 1 - 10
of 39
pro vyhledávání: '"孟毅"'
Publikováno v:
Shipin Kexue/ Food Science; 2024, Vol. 45 Issue 10, p272-280, 9p
Publikováno v:
Traditional Chinese Drug Research & Clinical Pharmacology; May2024, Vol. 35 Issue 5, p633-638, 6p
Publikováno v:
Journal of Shaanxi University of Science & Technology; Oct2023, Vol. 41 Issue 5, p57-63, 7p
Publikováno v:
China Dairy; 2024, Issue 5, p123-136, 8p
Publikováno v:
Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban); 2023, Vol. 43 Issue 1, p48-57, 10p
Publikováno v:
Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban); Aug2022, Vol. 42 Issue 8, p1375-1385, 11p
Autor:
Cho, Meng-Yi, 卓孟毅
107
In back-end-of-line (BEOL) metallization, TaN/ Ta has been widely used for Cu interconnect barrier layer to prevent Cu atoms from penetrating into porous low-k materials. As the continuous scaling in microelectronic devices to 28nm and beyon
In back-end-of-line (BEOL) metallization, TaN/ Ta has been widely used for Cu interconnect barrier layer to prevent Cu atoms from penetrating into porous low-k materials. As the continuous scaling in microelectronic devices to 28nm and beyon
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/4nfqc6
Publikováno v:
China Dairy; 2023, Issue 8, p50-56, 7p