Zobrazeno 1 - 6
of 6
pro vyhledávání: '"周思睿"'
Publikováno v:
Chinese Journal of Tissue Engineering Research / Zhongguo Zuzhi Gongcheng Yanjiu. 6/28/2024, Vol. 28 Issue 18, p2835-2839. 5p.
Autor:
Szu-Jui Chou, 周思睿
95
As IC process geometries shrink to 65nm and below, the post-CMP dielectric thickness variation control becomes a dominant technique for manufacturability. To improve CMP quality and enhance the yield, layout uniformity is necessary. Dummy met
As IC process geometries shrink to 65nm and below, the post-CMP dielectric thickness variation control becomes a dominant technique for manufacturability. To improve CMP quality and enhance the yield, layout uniformity is necessary. Dummy met
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/89134200887122922118
Publikováno v:
Acta Agronomica Sinica; 2024, Vol. 50 Issue 4, p857-870, 14p
Publikováno v:
Chinese Journal of Tissue Engineering Research / Zhongguo Zuzhi Gongcheng Yanjiu. 6/28/2019, Vol. 23 Issue 18, p2806-2811. 6p.
Publikováno v:
Journal of Modern Medicine & Health. 12/15/2015, Vol. 31 Issue 23, p3529-3534. 4p.
Publikováno v:
Chinese Journal of Tissue Engineering Research / Zhongguo Zuzhi Gongcheng Yanjiu; 2/28/2019, Vol. 23 Issue 6, p843-848, 6p