Zobrazeno 1 - 3
of 3
pro vyhledávání: '"吕继明"'
Publikováno v:
China Dairy; 2023, Issue 2, p74-78, 5p
Publikováno v:
China Dairy; 2022, Issue 10, p98-103, 6p
Autor:
Chi-Ming Lu, 呂繼明
97
We study the effects of commercial flux (A to D) on intermetallic compound (IMC) between Sn-Ag-Cu soldering ball and Ni-Au plated substrate. Several findings are uncovered after the examination of IMC thickness, ball-shear-force and ball-pull
We study the effects of commercial flux (A to D) on intermetallic compound (IMC) between Sn-Ag-Cu soldering ball and Ni-Au plated substrate. Several findings are uncovered after the examination of IMC thickness, ball-shear-force and ball-pull
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/63534811297774723520
