Zobrazeno 1 - 4
of 4
pro vyhledávání: '"叶 昀"'
Publikováno v:
Journal of Materials Engineering / Cailiao Gongcheng; Jul2022, Vol. 50 Issue 7, p30-39, 10p
Autor:
YEH, YUN-JIA, 葉昀嘉
105
In recent years, due to the progress on hardware of mobile devices, the implementation of SLAM on mobile devices becomes possible and is extended to many applications. Virtual reality and augmented reality became the fields that many compani
In recent years, due to the progress on hardware of mobile devices, the implementation of SLAM on mobile devices becomes possible and is extended to many applications. Virtual reality and augmented reality became the fields that many compani
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/78qx5n
Autor:
Yeh,Yun-Chuan, 葉昀娟
101
There were many researches on the topic of ‘night market’ industry, through methodologies such as action research, case study, literature review and structured interviewing. However, few of pass researches use models to elucidate night m
There were many researches on the topic of ‘night market’ industry, through methodologies such as action research, case study, literature review and structured interviewing. However, few of pass researches use models to elucidate night m
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/37054269565927375596
Autor:
葉昀鑫
90
The stress-strain behavior and thermal fatigue reliability for the lid-substrate adhesive and solder joints of thermal enhanced flip-chip BGA packages has been analyzed under different adhesive sizes. The finite element analysis code ANSYS wa
The stress-strain behavior and thermal fatigue reliability for the lid-substrate adhesive and solder joints of thermal enhanced flip-chip BGA packages has been analyzed under different adhesive sizes. The finite element analysis code ANSYS wa
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/28398311872361667735