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pro vyhledávání: '"古景銘"'
Autor:
Ching Ming Ku, 古景銘
98
This paper aims to study three-dimensional integrated circuits in silicon vias technology, dry etching process. And to explore how to enhance the silicon wafer etch rate and etching process of stability and uniformity, and to identify the sil
This paper aims to study three-dimensional integrated circuits in silicon vias technology, dry etching process. And to explore how to enhance the silicon wafer etch rate and etching process of stability and uniformity, and to identify the sil
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/13821310674341396100
