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pro vyhledávání: '"古振瑭"'
Autor:
Ku Chen-Tang, 古振瑭
92
This research is to develop a two-stage process model and to investigate effects of working parameters of the Dry Mechano-Chemical Polishing (DMCP) for single-crystal sapphire wafers with the SiO2 abrasives of average grit diameter 26 nm. The
This research is to develop a two-stage process model and to investigate effects of working parameters of the Dry Mechano-Chemical Polishing (DMCP) for single-crystal sapphire wafers with the SiO2 abrasives of average grit diameter 26 nm. The
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/20692405599298206205
