Zobrazeno 1 - 2
of 2
pro vyhledávání: '"卢游"'
Publikováno v:
Journal of Kunming Medical University / Kunming Yike Daxue Xuebao. 2024, Issue 7, p126-131. 6p.
107
Wire bonding process is the most extensive and important used in bonding technique for the packaging industry. The material of gold connection is still on the top of the list when designing in a circuit. However to stay in competitiveness an
Wire bonding process is the most extensive and important used in bonding technique for the packaging industry. The material of gold connection is still on the top of the list when designing in a circuit. However to stay in competitiveness an
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/vcatvw
