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pro vyhledávání: '"劉賢民"'
Autor:
HSIEN HIN LIU, 劉賢民
103
This thesis is focused on the study of the warpage phenomenon in Quad Flat Non-Leads package (QFN). It is found that the formation of warpage (up or down) is due the stress force between molding compound and substrate, and it is an effective
This thesis is focused on the study of the warpage phenomenon in Quad Flat Non-Leads package (QFN). It is found that the formation of warpage (up or down) is due the stress force between molding compound and substrate, and it is an effective
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/13317158313791723944
