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pro vyhledávání: '"劉業繡"'
Autor:
Yeh-Hsiu Liu, 劉業繡
93
In high temperature applications, the conversion of the under metallurgy (UBM) into UBM-Sn intermetallics can ultimately limit the reliability of flip chip components. The flip chip structures employed are eutectic or high-lead Sn/Pb solder j
In high temperature applications, the conversion of the under metallurgy (UBM) into UBM-Sn intermetallics can ultimately limit the reliability of flip chip components. The flip chip structures employed are eutectic or high-lead Sn/Pb solder j
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/42291409423986081307
