Zobrazeno 1 - 2
of 2
pro vyhledávání: '"劉桓吟"'
Autor:
Huan Yin Liu, 劉桓吟
104
With the advances of the electronic packaging, 2.5D IC and 3D IC with Cu through silicon vias (copper TSVs) which can providing the improvement of circuit density and interconnect performance become a trend. In every 2.5D IC, there is a Cu T
With the advances of the electronic packaging, 2.5D IC and 3D IC with Cu through silicon vias (copper TSVs) which can providing the improvement of circuit density and interconnect performance become a trend. In every 2.5D IC, there is a Cu T
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/36dvh8
