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Autor:
Ming-Xian Liu, 劉名峴
98
With SoC and System in Package SiP, the density of transistor on IC has being increased, and heat problem in the operating chip has become more critical. For this reason, in addition to the passive heat dissipation enhancement in high density
With SoC and System in Package SiP, the density of transistor on IC has being increased, and heat problem in the operating chip has become more critical. For this reason, in addition to the passive heat dissipation enhancement in high density
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/09515112428111409586
