Zobrazeno 1 - 10
of 18
pro vyhledávání: '"刘秉儒"'
Publikováno v:
Bulletin of Soil & Water Conservation; Aug2024, Vol. 44 Issue 4, p107-116, 10p
Publikováno v:
Journal of Northwest A & F University - Natural Science Edition; 2023, Vol. 51 Issue 7, p115-125, 11p
Publikováno v:
Bulletin of Botanical Research; Mar2023, Vol. 43 Issue 2, p186-193, 8p
Publikováno v:
Journal of Ecology & Rural Environment; 2023, Vol. 39 Issue 1, p97-106, 10p
Autor:
刘秉儒，张文文，李学斌 LIU Bingru
Publikováno v:
Acta Ecologica Sinica. 41
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e8d7bbedcedf34b4bf646ee9077532a
https://doi.org/10.5846/stxb202008022016
https://doi.org/10.5846/stxb202008022016
Publikováno v:
Arid Zone Research / Ganhanqu Yanjiu; 9/15/2022, Vol. 39 Issue 5, p1618-1630, 13p
Publikováno v:
Transactions of the Chinese Society of Agricultural Engineering; 2022, Vol. 38 Issue 15, p124-132, 9p
Publikováno v:
Acta Ecologica Sinica. 39
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::374063f7946d4ac9d4f3a8e9742c532e
https://doi.org/10.5846/stxb201810252309
https://doi.org/10.5846/stxb201810252309
Autor:
Liu, Ping-Ju, 劉秉儒
105
Semiconductor is a highly automatically industry, but semiconductor companies rely on engineers using eyeball analysis to judge wafer defect, like probe mark inspection during chip probe (CP). The probe mark will reduce wire bonding strange
Semiconductor is a highly automatically industry, but semiconductor companies rely on engineers using eyeball analysis to judge wafer defect, like probe mark inspection during chip probe (CP). The probe mark will reduce wire bonding strange
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/9uq53d
