Zobrazeno 1 - 10
of 21
pro vyhledávání: '"刘桓"'
Publikováno v:
Modern Educational Technology; 2024, Vol. 34 Issue 8, p59-68, 10p
Publikováno v:
Chinese Journal of Lasers. 49:1704002
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9a30af59678c27eedd2163478089180
https://doi.org/10.3788/cjl202249.1704002
https://doi.org/10.3788/cjl202249.1704002
Autor:
LIU,HUAN-CHIH, 劉桓志
106
The problem that International original pharmaceutical factories often face is that no breakthroughs are made in new drugs developments. That is also the reason why “patent cliff” happens. Generally, the sales will drop 40% down at the f
The problem that International original pharmaceutical factories often face is that no breakthroughs are made in new drugs developments. That is also the reason why “patent cliff” happens. Generally, the sales will drop 40% down at the f
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/nnqxwk
Autor:
LIU, HUAN-YU, 劉桓妤
106
Shibafen area is located in Yangmingshan National Park. Despite owning rich resources of nature and culture, tourism development is far behind other attraction spots in same field while various attacks occured in aspects of ecological emviro
Shibafen area is located in Yangmingshan National Park. Despite owning rich resources of nature and culture, tourism development is far behind other attraction spots in same field while various attacks occured in aspects of ecological emviro
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/e5czv6
Publikováno v:
China Mechanical Engineering; 7/25/2020, Vol. 31 Issue 12, p1452-1460, 9p
Autor:
Huan Yin Liu, 劉桓吟
104
With the advances of the electronic packaging, 2.5D IC and 3D IC with Cu through silicon vias (copper TSVs) which can providing the improvement of circuit density and interconnect performance become a trend. In every 2.5D IC, there is a Cu T
With the advances of the electronic packaging, 2.5D IC and 3D IC with Cu through silicon vias (copper TSVs) which can providing the improvement of circuit density and interconnect performance become a trend. In every 2.5D IC, there is a Cu T
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/36dvh8
103
In recentlt years, institutional research becomes a very hot topic, its function is to find common phenomenon with changes occurring on campus, identify problems and deal with problems, but also examine domestic and international trends in h
In recentlt years, institutional research becomes a very hot topic, its function is to find common phenomenon with changes occurring on campus, identify problems and deal with problems, but also examine domestic and international trends in h
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/vr3yer
Autor:
LIOU,HUAN-GE, 劉桓合
103
With the economic development changing people’s spending habits. People eating increased meal in the restaurant not only enjoy the food, consumers pay more attention to the value of consumer’s perception, generate satisfaction in order t
With the economic development changing people’s spending habits. People eating increased meal in the restaurant not only enjoy the food, consumers pay more attention to the value of consumer’s perception, generate satisfaction in order t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/zpck7b
Autor:
Huan-Chia Liu, 劉桓嘉
103
Ultrasonic measurement has been used for ocean engineering, noninvasive medical application, and nondestructive testing for years. Ultrasound transducer plays a significant role in whole system. Ultrasonic transducer is piezoelectric transdu
Ultrasonic measurement has been used for ocean engineering, noninvasive medical application, and nondestructive testing for years. Ultrasound transducer plays a significant role in whole system. Ultrasonic transducer is piezoelectric transdu
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/45693393072351509061
Autor:
Liu, Huan-Cheng, 劉桓成
102
This thesis presents an isolated bi-directional charger/discharger, which is integrated with a bi-directional inverter for UPS applications. A dual full-bridge topology is adopted in this system. It can achieve high conversion ratio and high
This thesis presents an isolated bi-directional charger/discharger, which is integrated with a bi-directional inverter for UPS applications. A dual full-bridge topology is adopted in this system. It can achieve high conversion ratio and high
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/01225130018476805603