Zobrazeno 1 - 7
of 7
pro vyhledávání: '"刘世国"'
Publikováno v:
Shandong Medical Journal. 2/16/2018, Vol. 58 Issue 7, p14-17. 4p.
Publikováno v:
Chinese Journal of Contemporary Pediatrics; Oct2019, Vol. 21 Issue 10, p972-976, 5p
Autor:
Liu, Shi-Guo, 劉世國
99
The manufacturing process technology of semiconductor industry has been rapid improved recently. The high aspect ratio and high density of the IC device cause the higher requirement of the flatness of the SI wafer. The globe planarization has
The manufacturing process technology of semiconductor industry has been rapid improved recently. The high aspect ratio and high density of the IC device cause the higher requirement of the flatness of the SI wafer. The globe planarization has
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/76229059996882604308
Autor:
Shih-Kuo Liu, 劉世國
95
This study is to focus on the refashioning using inner support of square homogeneous plate with fixed ends. To achieve the suppressing of the acoustic power radiation from plate, the fundamental mode is destroyed first to shift the associated
This study is to focus on the refashioning using inner support of square homogeneous plate with fixed ends. To achieve the suppressing of the acoustic power radiation from plate, the fundamental mode is destroyed first to shift the associated
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/54134818549399400037