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pro vyhledávání: '"何丞林"'
Autor:
Cheng-Lin Ho, 何丞林
92
Nowadays, the favor of electronic devices with diverse functions, portability and very high performance has pushed the design of IC packages to a new era with higher I/O densities, smaller packaging size, and faster operation frequency. The c
Nowadays, the favor of electronic devices with diverse functions, portability and very high performance has pushed the design of IC packages to a new era with higher I/O densities, smaller packaging size, and faster operation frequency. The c
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/60183020225977678456
