Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Łukasz Dowhań"'
Autor:
Artur Wymysłowski, Łukasz Dowhań
Publikováno v:
Microelectronics Reliability. 53:443-451
Nanoindentation is one of the most known method for investigating the properties of thin films. The materials can be assessed by means of elastic mechanical properties (hardness and Young’s modulus). However, the author’s research work shows that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::774c4a254e63fe87315149a0eb467a71
https://doi.org/10.1016/j.microrel.2012.10.009
https://doi.org/10.1016/j.microrel.2012.10.009
Publikováno v:
Microelectronics Reliability. 51:1276-1282
The authors of this research would like to present the numerical prototyping methods in reference to design of microsystem silicon accelerometer. As an example device the capacitive accelerometer was taken into account. The accelerometer was prepared
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19da041050b28c0fb92dc67b3e712ba3
https://doi.org/10.1016/j.microrel.2011.03.017
https://doi.org/10.1016/j.microrel.2011.03.017
Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials in mic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::660062e6b551116e58ed74f6db7ab3fa
https://publica.fraunhofer.de/handle/publica/225092
https://publica.fraunhofer.de/handle/publica/225092
Nowadays, numerical prototyping methods in electronic packaging are widely used. This is mainly due to cost and time reduction and improved functionality and reliability of final products. Recently, there has been a lot of interest and work conducted
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2f4f337464ae7f30d9c541fd04718e5d
https://publica.fraunhofer.de/handle/publica/219694
https://publica.fraunhofer.de/handle/publica/219694