Zobrazeno 11 - 20
of 1 387
pro vyhledávání: '"Sinha, Saurabh"'
Publikováno v:
In Prostaglandins and Other Lipid Mediators October 2024 174
Autor:
Zhou, Daniel J., Woodson-Smith, Sarah, Emmert, Brian E., Kornspun, Alana, Larocque, Joshua, Kulick-Soper, Catherine V., Qiu, Maylene K., Ellis, Colin A., Gugger, James J., Conrad, Erin C., Waldman, Genna, Ganguly, Taneeta, Sinha, Saurabh R., Davis, Kathryn A., Stein, Joel M., Liu, Grant T., Gelfand, Michael, Raghupathi, Ramya
Publikováno v:
In Epilepsy & Behavior September 2024 158
In migrating production workloads to cloud, enterprises often face the daunting task of evolving monolithic applications toward a microservice architecture. At IBM, we developed a tool called Mono2Micro to assist with this challenging task. Mono2Micr
Externí odkaz:
http://arxiv.org/abs/2107.09698
Autor:
Crank, Matthew, Sinha, Saurabh
Publikováno v:
In Surgery (Oxford) April 2024 42(4):224-230
Energetic electrons inside Earth's outer Van Allen belt pose a major radiation threat to space-borne electronics that often play vital roles in our modern society. Ultra-relativistic electrons with energies greater than or equal to two Megaelectron-v
Externí odkaz:
http://arxiv.org/abs/2104.09055
Autor:
Emmert, Brian E., Xie, Kevin, Conrad, Erin C., Ghosn, Nina J., Bauman, Kristie, Korzun, Jacob, Kulick-Soper, Catherine V., Naveed, Omer, Hartmann, Nicole, LaRocque, Joshua J., Mindy Ganguly, Taneeta, Gugger, James J., Raghupathi, Ramya, Gelfand, Michael A., Davis, Kathryn A., Sinha, Saurabh R., Litt, Brian, Shinohara, Russell T., Ellis, Colin A.
Publikováno v:
In Epilepsy & Behavior January 2024 150
Autor:
Mathur, Rahul, Chao, Chien-Ju, Liu, Rossana, Tadepalli, Nikhil, Chandupatla, Pranavi, Hung, Shawn, Xu, Xiaoqing, Sinha, Saurabh, Kulkarni, Jaydeep
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m p
Externí odkaz:
http://arxiv.org/abs/2007.16179
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and cost but t
Externí odkaz:
http://arxiv.org/abs/2005.10866
Autor:
Nakhate, Vinayak P., Akojwar, Natasha S., Sinha, Saurabh K., Lomte, Amarsinh D., Dhobi, Mahaveer, Itankar, Prakash R., Prasad, Satyendra K.
Publikováno v:
In Journal of Traditional and Complementary Medicine September 2023 13(5):489-499