Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Onyelowe, Kennedy C."'
Autor:
Onyelowe, Kennedy C.1 (AUTHOR), Shakeri, Jamshid2 (AUTHOR), Amini-Khoshalan, Hasel3 (AUTHOR), Usungedo, Thompson F.4 (AUTHOR), Alimoradi-Jazi, Mohammadreza5 (AUTHOR)
Publikováno v:
Advances in Materials Science & Engineering. 2/27/2022, p1-17. 17p.
Autor:
Onyelowe, Kennedy C1 (AUTHOR) kennedychibuzor@kiu.ac.ug, Ebid, Ahmed M2 (AUTHOR), Onyia, Michael E3 (AUTHOR), Amanamba, Ezenwa C4 (AUTHOR)
Publikováno v:
International Journal of Low Carbon Technologies. 2022, Vol. 17, p807-815. 9p.
Autor:
Onyelowe, Kennedy C1 (AUTHOR) kennedychibuzor@kiu.ac.ug, Tome, Sylvain2 (AUTHOR), Ebid, Ahmed M3 (AUTHOR), Usungedo, Thompson4 (AUTHOR), Van, Duc Bui5 (AUTHOR), Etim, Roland K6 (AUTHOR), Onuoha, Ifeanyi C7 (AUTHOR), Attah, Imoh C6 (AUTHOR)
Publikováno v:
International Journal of Low Carbon Technologies. 2022, Vol. 17, p563-570. 8p.
Autor:
ONYELOWE, KENNEDY C.1 konyelowe@mouau.edu.ng, ONYIA, MICHAEL E.2 michael.onyia@unn.edu.ng, DUC BUI VAN3 buivanduc@humg.edu.vn, FIROOZI, ,ALI A.4 firoozia@ub.ac.bw, AMHADI, TALAL5 talal.amhadi.1@ens.etsmtl.ca
Publikováno v:
Építőanyag: Journal of Silicate Based & Composite Materials. 2021, Vol. 73 Issue 3, p86-90. 5p.
Autor:
Onyelowe, Kennedy C.1,2 (AUTHOR)
Publikováno v:
Mathematical Problems in Engineering. 4/28/2021, p1-6. 6p.
Autor:
Onyelowe, Kennedy C.1,2 (AUTHOR), Onyia, Michael E.3 (AUTHOR), Bui Van, Duc2 (AUTHOR), Baykara, Haci4 (AUTHOR), Ugwu, Hyginus U.5 (AUTHOR)
Publikováno v:
Advances in Materials Science & Engineering. 3/26/2021, p1-7. 7p.
Autor:
Onyelowe, Kennedy C.1 (AUTHOR), Onyia, Michael E.2 (AUTHOR), Nguyen-Thi, Diu3 (AUTHOR), Bui Van, Duc4 (AUTHOR), Onukwugha, Eze5 (AUTHOR), Baykara, Haci6 (AUTHOR), Obianyo, Ifeoma. I.7 (AUTHOR), Dao-Phuc, Lam8 (AUTHOR), Ugwu, Hyginus U.9 (AUTHOR)
Publikováno v:
Advances in Materials Science & Engineering. 2/12/2021, p1-10. 10p.
Autor:
Onyelowe, Kennedy C., Jalal, Fazal E., Onyia, Michael E., Onuoha, Ifeanyichukwu C., Alaneme, George U.
Publikováno v:
Applied Computational Intelligence & Soft Computing; 4/14/2021, p1-17, 17p