Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Chun-Hway Hsueh"'
Publikováno v:
Journal of Materials Research. 26:1279-1284
Microcantilevers fabricated by microelectromechanical system processes were used to study the residual stresses in the film/substrate systems. Aluminum films were deposited on silicon nitride substrates by thermal evaporation at room and elevated tem
Autor:
Chun-Hway Hsueh
Publikováno v:
Journal of Crystal Growth. 258:302-309
The elastic stress distribution resulting from both lattice mismatch and thermal mismatch in a film/graded layer/substrate system is considered. Both numerical and analytical models have been developed previously to analyze this problem. An alternati
Publikováno v:
Journal of Applied Physics. 93:2453-2457
Although the Maxwell model was widely applied to analyze viscoelastic behavior of film/substrate systems, Rafferty et al. [Appl. Phys. Lett. 54, 151 (1989)] found that the structural relaxation of silicon oxide films on silicon wafers during thermal
Autor:
Mattison K. Ferber, Chun-Hway Hsueh
Publikováno v:
Composites Part A: Applied Science and Manufacturing. 33:1115-1121
The thermal expansion behavior and residual stresses in multilayer capacitor (MLC) systems are analyzed in the present study. An MLC consists of a laminate of multiple alternating electrode layers and dielectric layers sandwiched between two ceramic
Autor:
Chun-Hway Hsueh, Sanboh Lee
Publikováno v:
Journal of Applied Physics. 91:2760-2765
An analytical model is developed to analyze the effects of viscous flow on residual stresses in film/substrate systems. This is achieved by utilizing the analogy between the governing field equation of elasticity and the Laplace transform with respec
Autor:
Chun-Hway Hsueh
Publikováno v:
Journal of the American Ceramic Society. 84:2955-2961
Multiple film cracking in a film/substrate system is analyzed in the present study. The system is subjected to residual stresses before loading. A constant displacement rate is applied unidirectionally to stretch the system. An analytical model is de
Autor:
Chun-Hway Hsueh
Publikováno v:
Journal of Applied Physics. 88:3022-3028
The residual stress distribution in a thin-film strip overlaid on a substrate is influenced by the edges of the strip. An analytical model is developed to derive a closed-form solution for the stress distribution along the film width. Because the fil
Autor:
Edwin R. Fuller, Chun-Hway Hsueh
Publikováno v:
Materials Science and Engineering: A. 283:46-55
The effects of curvature and height of the interface asperity on residual thermal stresses in a plasma-sprayed thermal barrier coating were numerically simulated. In the tip region of a convex asperity, the residual stress normal to the interface, sy
Autor:
C.G. Westmoreland, Chun-Hway Hsueh, Ellen Y. Sun, Shyh-Lung Hwang, Paul F. Becher, Shirley B. Waters, K. B. Alexander
Publikováno v:
Acta Materialia. 44:3881-3893
Crack bridging mechanisms in self-reinforced silicon nitride ceramics rely on interfacial debonding and intergranular fracture processes. The toughening effects can be enhanced by increasing the diameter of the elongated grains. However, the composit
Autor:
Paul F. Becher, Chun-Hway Hsueh
Publikováno v:
Materials Science and Engineering: A. 212:22-28
Residual thermal stresses in ceramic matrix composites containing ellipsoidal inclusions are analyzed using a modified Eshelby model. Closed-form analytical solutions are obtained; however, their formulations are formidable. When the inclusion is dis