Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Quan Lu"'
Publikováno v:
Materials & Design, Vol 140, Iss, Pp 64-72 (2018)
Nanosilver sintering is expected to overcome the limitation of relatively high production cost and become widely available for the die bonding of power electronics. A potential application of nanosilver sintering is bare copper bonding, where replaci
Publikováno v:
Materials Letters. 206:1-4
The inhibition effect and mechanism of adding palladium particles to nano-silver paste on the migration of silver in high temperature is reported. The electrochemical migration (ECM) tests showed that silver migration was significantly delayed by the
Publikováno v:
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD).
Sintered-silver die-attach has emerged as an excellent lead-free and reliable solution for high-temperature packaging. However, the most widely reported process involves pressure-assisted silver sintering on direct-bond-copper (DBC) substrates that a
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
Die-attach by metal-powder sintering is being widely adopted in the power electronics industry for manufacturing power semiconductor discrete devices and modules. Thus far, the most widely practiced process involves pressure-assisted silver sintering
Publikováno v:
Journal of Alloys and Compounds. 675:317-324
We studied the diffusion bonding mechanism and interfacial reactions between sintered nanosilver and direct-bond-copper substrates with different surface finishes, i.e., electroless nickel immersion gold (ENIG) and electroplated nickel gold (Ni/Au).
Publikováno v:
Journal of Materials Science: Materials in Electronics. 27:10941-10950
Silver paste sintering on bare Cu substrates can be of significant interest in power semiconductor manufacturing. However, the bare Cu substrates easily oxidized and the die attachment using the silver paste commonly applied pressure. In this study,
Publikováno v:
Materials Science and Engineering: A. 660:71-76
The nanosilver sintering die-attach technique has been a promising alternative for wide band gap semiconductors. However, it is less preferable in industry because of its high sintering temperature. Recently research has been initiated to develop tra
Publikováno v:
Journal of Electronic Materials. 45:3003-3012
In recent years, sintering nano-silver paste has become a popular worldwide technology. This paper presents the effect of ultrasonic vibration on the microstructure and mechanical properties of pressureless sintered nano-silver joints. Ultrasonic wav
Publikováno v:
Journal of Alloys and Compounds. 659:95-100
Lead free solder Sn 96.5 Ag 3 . 0 Cu 0.5 (SAC305) and nano-silver paste were used to connect graded thermoelectric (TE) arms, respectively. A series of harsh aging tests were carried out on joints of both p-type and n-type graded TE arms. The results
Publikováno v:
Materials & Design, Vol 89, Iss, Pp 604-610 (2016)
For high conversion efficiency thermoelectric generators, the preparation of fine and stable junctions between thermoelectric (TE) materials and electrodes is one of the core issues. In this paper, TE material AgSbTe2.01 applied in medium temperature