Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Akiko Okada"'
Autor:
Hiroshi Nishikawa, Weixin Fu, Tatsushi Kaneda, Mikiko Saito, Shuichi Shoji, Akiko Okada, Kaori Matsunaga, Jun Mizuno
Publikováno v:
Journal of Electronic Materials. 47:5952-5958
This paper describes low-temperature bonding realized by squeegee-embedded Au nanoporous bumps that were activated by vacuum ultraviolet in the presence of oxygen (VUV/O3). The VUV/O3 technology is confirmed to be a suitable surface treatment techniq
Publikováno v:
Microelectronic Engineering. 169:39-42
A novel strategy for fabricating nanostructures was demonstrated that combined nanoimprint lithography and anisotropic wet etching. The resolution of proposed method does not depend on that of an original imprint mold. Atomically sharp V-grooves were
Publikováno v:
IEEJ Transactions on Sensors and Micromachines. 137:72-77
Publikováno v:
Fuel. 182:304-313
The densities of re-melted coal slag melts were measured in air using Archimedean double-bob method in the temperature range from 1350 to 1600 °C. The main components of gasified coal slags are SiO2, Al2O3, CaO, MgO, FeO and Fe2O3. Slags consisting
Autor:
Chihaya Adachi, Jun Mizuno, Chang-Hoon Shim, Tomohiko Edura, S. Yamada, Akiko Okada, S. Shoji
Publikováno v:
Microelectronic Engineering. 161:94-97
We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interc
Autor:
Takafumi Honzawa, Philip John Bowen, Agustin Valera-Medina, Akiko Okada, Ryoichi Kurose, Reo Kai
Publikováno v:
Energy. 186:115771
A large-eddy simulation (LES) employing a non-adiabatic flamelet generated manifold approach, which can account for the effects of heat losses due to radiation and cold walls, is applied to NH3/CH4/air combustion fields generated by a swirl burner, a
Autor:
Takashi Kasahara, Weixin Fu, Masatsugu Nimura, Akiko Okada, Shuichi Shoji, Hayata Mimatsu, Shugo Ishizuka, Jun Mizuno
Publikováno v:
Journal of Electronic Materials. 44:4646-4652
The future development of low-temperature and low-pressure bonding technology is necessary for fine-pitch bump application. We propose a bump structure using Ag nanoparticles as an intermediate layer coated on a fine-pitch Cu pillar bump. The interme
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 8:74-80
Autor:
Yuji Oki, Takeshi Komino, Jean-Charles Ribierre, Jun Mizuno, Chihaya Adachi, Hiroyuki Kuwae, Weixin Fu, Akiko Okada
Publikováno v:
ACS applied materialsinterfaces. 9(32)
By preparing parallelly aligned 1.9-μm-high SiO2 microfluidic channels on an indium tin oxide substrate surface, the solution flow direction during spin-coating was controlled to be parallel to the grating. Using this technique, a pentafluorene–4,
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Development of surface acoustic wave (SAW) devices has been getting attention to achieve next fifth generation (5G) mobile communications. We had previously proposed a temperature compensated SAW substrate, LiTaO 3 (LT: lithium tantalate)/ST-cut quar