Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Huang, Guangwen"'
Publikováno v:
International Journal of Thermal Sciences. 170:107145
The ever-increasing performance of thin portable electronic products has made their heat dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra-thin vapor chamber (UTVC) with six spiral woven meshes and single-lay
Publikováno v:
International Journal of Heat and Mass Transfer. 176:121467
The rapid development of high-performance portable electronics requires ultra-thin heat pipes (UTHPs) with higher heat transfer capacity to meet their heat dissipation needs. Wick structure, the key component of a heat pipe, makes a decisive role in
Publikováno v:
Applied Thermal Engineering. 167:114726
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm thick) with four spiral woven meshes and one bottom mesh composite wick
Publikováno v:
International Journal of Heat and Mass Transfer. 148:119101
With the miniaturization and integration of portable devices, ultra-thin vapor chamber (UTVC) is required to have thinner thickness and better heat transfer performance. However, the reduction in thickness usually causes a decrease in heat transfer c
Publikováno v:
Applied Thermal Engineering. 162:114263
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, cost-effective mesh-type UTVCs (total thickness: 1.26–1.77 mm) were fabricated and investi
Autor:
Huang, Guangwen1 (AUTHOR), Liu, Wangyu1 (AUTHOR) mewyliu@scut.edu.cn, Luo, Yuanqiang1 (AUTHOR), Li, Yong1 (AUTHOR)
Publikováno v:
Applied Thermal Engineering. Feb2020, Vol. 167, pN.PAG-N.PAG. 1p.
Autor:
Huang, Guangwen1 (AUTHOR), Liu, Wangyu1 (AUTHOR) mewyliu@scut.edu.cn, Luo, Yuanqiang1 (AUTHOR), Deng, Tao1 (AUTHOR), Li, Yong1 (AUTHOR), Chen, Hanyin2 (AUTHOR)
Publikováno v:
International Journal of Heat & Mass Transfer. Feb2020, Vol. 148, pN.PAG-N.PAG. 1p.