Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Pei, W."'
Autor:
Sun Q; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Zhang S; Hebei Key Laboratory of Bioelectromagnetics and Neural Engineering, School of Health Sciences and Biomedical Engineering, Hebei University of Technology, Tianjin 300130, China., Dong G; Hebei Key Laboratory of Bioelectromagnetics and Neural Engineering, School of Health Sciences and Biomedical Engineering, Hebei University of Technology, Tianjin 300130, China., Pei W; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Gao X; Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing 100084, China., Wang Y; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; Chinese Institute for Brain Research, Beijing 102206, China.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2024 May 30; Vol. 24 (11). Date of Electronic Publication: 2024 May 30.
Autor:
Zheng L; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China., Dong Y; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Tian S; Brain Machine Fusion Intelligence Institute, Suzhou 215133, People's Republic of China., Pei W; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing 100084, People's Republic of China., Wang Y; Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China.; Chinese Institute for Brain Research, Beijing 102206, People's Republic of China.
Publikováno v:
Journal of neural engineering [J Neural Eng] 2024 Apr 02; Vol. 21 (2). Date of Electronic Publication: 2024 Apr 02.
Autor:
Gu M; Key Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China.; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, 100049, China., Pei W; Key Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing, 100049, China., Gao X; Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084, China., Wang Y; Key Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China. wangyj@semi.ac.cn.; School of Future Technology, University of Chinese Academy of Sciences, Beijing, 100049, China. wangyj@semi.ac.cn.; Chinese Institute for Brain Research, Beijing, 102206, China. wangyj@semi.ac.cn.
Publikováno v:
Scientific data [Sci Data] 2024 Feb 13; Vol. 11 (1), pp. 196. Date of Electronic Publication: 2024 Feb 13.
Publikováno v:
IEEE transactions on neural systems and rehabilitation engineering : a publication of the IEEE Engineering in Medicine and Biology Society [IEEE Trans Neural Syst Rehabil Eng] 2024; Vol. 32, pp. 1090-1099. Date of Electronic Publication: 2024 Mar 11.
Autor:
Zhao H; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; Beijing Institute of Graphic Communication, Beijing 102600, People's Republic of China., Zheng L; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Yuan M; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Wang Y; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing 100084, People's Republic of China., Liu R; Beijing Institute of Graphic Communication, Beijing 102600, People's Republic of China., Pei W; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China.
Publikováno v:
Journal of neural engineering [J Neural Eng] 2023 Jul 20; Vol. 20 (4). Date of Electronic Publication: 2023 Jul 20.
Autor:
Ming G; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Zhong H; Jiangsu JITRI Brian Machine Fusion Intelligence Institute, Suzhou 215008, People's Republic of China., Pei W; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing 100084, People's Republic of China., Wang Y; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China.; Chinese Institute for Brain Research, Beijing 102206, People's Republic of China.
Publikováno v:
Journal of neural engineering [J Neural Eng] 2023 Mar 13; Vol. 20 (2). Date of Electronic Publication: 2023 Mar 13.
Autor:
Sun Q; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Zheng L; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Pei W; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing 100084, China., Wang Y; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China; Chinese Institute for Brain Research, Beijing 102206, China. Electronic address: wangyj@semi.ac.cn.
Publikováno v:
Journal of neuroscience methods [J Neurosci Methods] 2022 Jun 01; Vol. 375, pp. 109597. Date of Electronic Publication: 2022 Apr 12.
Autor:
Zheng L; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Pei W; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China., Gao X; Department of Biomedical Engineering, Tsinghua University, Beijing 100084, People's Republic of China., Zhang L; Beijing Machine and Equipment Institute, Beijing 100854, People's Republic of China., Wang Y; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, People's Republic of China.
Publikováno v:
Journal of neural engineering [J Neural Eng] 2022 Jan 24; Vol. 19 (1). Date of Electronic Publication: 2022 Jan 24.
Autor:
Ming G; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing, People's Republic of China., Pei W; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing, People's Republic of China., Chen H; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, People's Republic of China.; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, People's Republic of China., Gao X; Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, People's Republic of China., Wang Y; State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, People's Republic of China.; School of Future Technology, University of Chinese Academy of Sciences, Beijing, People's Republic of China.
Publikováno v:
Journal of neural engineering [J Neural Eng] 2021 Oct 05; Vol. 18 (5). Date of Electronic Publication: 2021 Oct 05.
Publikováno v:
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference [Annu Int Conf IEEE Eng Med Biol Soc] 2020 Jul; Vol. 2020, pp. 3054-3057.