Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Christopher, Mark"'
Autor:
Andrew M. Herring, Yuan Yang, Hai Long, Andrew R. Motz, Mei-Chen Kuo, Christopher Mark Maupin, Ashutosh G. Divekar, Zachary S. Page‐Belknap, Andrew M. Park, Zbyslaw R. Owczarczyk, Bryan S. Pivovar, Michael A. Yandrasits, Soenke Seifert
Publikováno v:
Journal of Polymer Science Part B: Polymer Physics. 57:700-712
Publikováno v:
International Journal of Heat and Fluid Flow. 88:108729
Vortex-induced vibrations of a circular cylinder has been investigated experimentally using a cyber-physical apparatus with m ∗ = 8 and ζ = 0.005 . The Reynolds number is held fixed at Re = 4000 , with the reduced velocity being modified via a cha
Publikováno v:
Microelectronics Reliability. 111:113740
This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film. The effects of three main sintering parameters, sintering temperature (220 to 300 °C), sint
Publikováno v:
IndraStra Global.
The power cycling reliability of flexible printed circuit board (PCB) interconnect smaller/thinner (ST) 9.5 mm × 5.5 mm × 0.07 mm and larger/thicker (LT) 13.5 mm × 13.5 mm × 0.5 mm single Si diode samples have been studied. With the assumption of
Publikováno v:
Molecular Crystals and Liquid Crystals. 604:11-26
© 2014 Copyright © Taylor & Francis Group, LLC. The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240°C and 5 MPa for 3 to 17 minutes. Their microstructural features were quantitatively ch
Publikováno v:
Microelectronics Reliability. 54:2006-2012
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, begin- force, end-force and touch-down step
Publikováno v:
Journal of Electronic Materials. 43:983-995
Real Si insulated gate bipolar transistors with conventional Ni/Ag metallization and dummy Si chips with thickened Ni/Ag metallization have both been bonded, at 250°C for 0 min, 40 min, and 640 min, to Ag foil electroplated with 2.7 μm and 6.8 μm
Autor:
Paul Evans, Jianfeng Li, Nevil L. Mattey, Pearl Agyakwa, Christopher Mark Johnson, Robert Skuriat
Publikováno v:
Microelectronics Reliability. 53:1933-1942
The specific thermal resistance values of several thermal interface materials (TIMs) intended to thermally enhance Cu contact pairs and their degradation under isothermal ageing at 170 °C have been investigated using Cu stack samples consisting of 1
Autor:
Christopher Mark Johnson, V. M. F. Marques, Li Yang, Jianfeng Li, Pearl Agyakwa, Martin Corfield
Publikováno v:
Journal of Electronic Materials. 42:537-544
Recent findings suggest that creep occurs during thermal cycling of ultrasonically bonded wires, the extent of which is influenced by the nature of the temperature cycle, particularly its peak temperature. In this work, this hypothesis is investigate
Publikováno v:
Microelectronics Reliability. 52:2358-2362
Non-destructive testing capability is a very important aspect of power device technology evolution towards more robust and reliable products. This paper proposes a closed-loop non-destructive tester for high power multi-chip IGBT modules. Other than