Zobrazeno 1 - 10
of 154
pro vyhledávání: '"679"'
Autor:
Olou, Hervé B.1 (AUTHOR) herve.olou@imsp-uac.org, Ezin, Eugène C.1,2 (AUTHOR), Dembele, Jean Marie3,4 (AUTHOR), Cambier, Christophe4 (AUTHOR)
Publikováno v:
Unmanned Systems. Oct2023, p1-17. 17p.
Autor:
Woodrow, Luis1 (AUTHOR) luis.woodrow@des.qld.gov.au, Carter, John1 (AUTHOR), Fraser, Grant1 (AUTHOR), Barnetson, Jason1 (AUTHOR)
Publikováno v:
AgriEngineering. Jun2023, Vol. 5 Issue 2, p1051-1067. 17p.
Autor:
Alhuseen, Zainab Ali Abd1 zainab.alhussen.gsci111@student.uobabylon.edu.iq, Joda, Fanar Ali2, Naser, Mohammed Abdullah1
Publikováno v:
Ingénierie des Systèmes d'Information. Oct2023, Vol. 28 Issue 5, p1151-1159. 9p.
Publikováno v:
Advanced Intelligent Systems (2640-4567); Apr2024, Vol. 6 Issue 4, p1-14, 14p
Publikováno v:
Ingénierie des Systèmes d'Information. Jun2023, Vol. 28 Issue 3, p693-701. 9p.
Autor:
Tu, Keling1 (AUTHOR), Wen, Shaozhe2 (AUTHOR), Cheng, Ying1 (AUTHOR), Xu, Yanan1 (AUTHOR), Pan, Tong1 (AUTHOR), Hou, Haonan1 (AUTHOR), Gu, Riliang1 (AUTHOR), Wang, Jianhua1 (AUTHOR), Wang, Fengge3 (AUTHOR) gege0106@163.com, Sun, Qun1 (AUTHOR) sunqun@cau.edu.cn
Publikováno v:
Plant Methods. 6/11/2022, Vol. 18 Issue 1, p1-17. 17p.
Autor:
Schneider, Pascal1 (AUTHOR) pascal.schneider@dfki.de, Anisimov, Yuriy1 (AUTHOR) raisulzaeem@gmail.com, Islam, Raisul1 (AUTHOR) bruno.mirbach@dfki.de, Mirbach, Bruno1 (AUTHOR) didier.stricker@dfki.de, Rambach, Jason1 (AUTHOR) pascal.schneider@dfki.de, Stricker, Didier1 (AUTHOR), Grandidier, Frédéric2 (AUTHOR) frederic.grandidier@iee.lu
Publikováno v:
Sensors (14248220). Jun2022, Vol. 22 Issue 11, p3992-3992. 13p.
Publikováno v:
Advanced Intelligent Systems (2640-4567); Dec2023, Vol. 5 Issue 12, p1-8, 8p
Autor:
Uzakkyzy, Nurgul, Ismailova, Aisulu, Ayazbaev, Talgatbek, Beldeubayeva, Zhanar, Kodanova, Shynar, Utenova, Balbupe, Satybaldiyeva, Aizhan, Kaldarova, Mira
Publikováno v:
International Journal of Electrical & Computer Engineering (2088-8708); Dec2023, Vol. 13 Issue 6, p6855-6861, 7p
Publikováno v:
Intelligent Automation & Soft Computing; 2023, Vol. 38 Issue 2, p139-151, 13p