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Autor:
Joon Seok Oh, Yoon Young Jeon, Changbo Lee, Sangyun Lee, Young-Min Kim, Hyun-Dong Lee, Minju Kim
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Since InFO WLP (Integrated Fan-out wafer level package) technology was successfully launched on the packaging field in 2016, the interest in fan-out package technology has increased significantly due to small footprint, enhanced speed gain and power