Zobrazeno 1 - 7
of 7
pro vyhledávání: '"F. Rinaldi"'
Publikováno v:
2007 European Conference on Lasers and Electro-Optics and the International Quantum Electronics Conference.
This paper presents a novel fabrication scheme for mesa-isolated monolithic vertical-cavity surface-emitting lasers (VCSELs) based on fully self-aligning processes. In the new design, heat extraction from the devices' active regions is strongly enhan
Autor:
Manikandan Chandran, I. Kardosh, P. Gerlach, M. Stach, R. Michalzik, F. Rinaldi, S. Lorch, Hendrik Roscher
Publikováno v:
SPIE Proceedings.
We report on the design, fabrication and test results of monolithically integrated transceiver chips consisting of GaAs metal-semiconductor-metal photodiodes and 850nm wavelength vertical-cavity surface-emitting lasers. These chips are well suited fo
Publikováno v:
SPIE Proceedings.
Using vertical-cavity surface-emitting lasers (VCSELs) as light sources in optical traps offers various advantages compared to the common approaches. In particular, these are small dimensions, a circularly symmetric output beam, and the simple fabric
Publikováno v:
SPIE Proceedings.
High-performance vertical-cavity surface-emitting lasers (VCSELs) with an emission wavelength of approximately 764 nm are demonstrated. This wavelength is very attractive for oxygen sensing. Low threshold currents, high optical output power, single-m
Publikováno v:
CLEO/Europe. 2005 Conference on Lasers and Electro-Optics Europe, 2005..
In this paper, demonstration shows that the optical power level necessary for particle trapping can be achieved by lensed VCSELs. Therefore, the next step will be to adopt lensed VCSELs in integrated optical tweezers. Nowadays, commercial optical twe
Publikováno v:
Electronics Letters. 44:353
Densely packed arrays of vertical-cavity surface-emitting lasers (VCSELs) are presented, serving as low-cost and small-sized laser sources in optical particle manipulation systems. A novel, self-aligned fabrication process enables both a pitch in the
Publikováno v:
Electronics Letters. 42:716
The design, fabrication and test results of monolithically integrated transceiver chips consisting of GaAs metal-semiconductor-metal photodiodes and 850 nm wavelength vertical-cavity surface-emitting lasers is presented. These chips are well suited f