Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Akiko Okada"'
Autor:
Hiroshi Nishikawa, Weixin Fu, Tatsushi Kaneda, Mikiko Saito, Shuichi Shoji, Akiko Okada, Kaori Matsunaga, Jun Mizuno
Publikováno v:
Journal of Electronic Materials. 47:5952-5958
This paper describes low-temperature bonding realized by squeegee-embedded Au nanoporous bumps that were activated by vacuum ultraviolet in the presence of oxygen (VUV/O3). The VUV/O3 technology is confirmed to be a suitable surface treatment techniq
Publikováno v:
Microelectronic Engineering. 169:39-42
A novel strategy for fabricating nanostructures was demonstrated that combined nanoimprint lithography and anisotropic wet etching. The resolution of proposed method does not depend on that of an original imprint mold. Atomically sharp V-grooves were
Publikováno v:
IEEJ Transactions on Sensors and Micromachines. 137:72-77
Autor:
Chihaya Adachi, Jun Mizuno, Chang-Hoon Shim, Tomohiko Edura, S. Yamada, Akiko Okada, S. Shoji
Publikováno v:
Microelectronic Engineering. 161:94-97
We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interc
Autor:
Yuji Oki, Takeshi Komino, Jean-Charles Ribierre, Jun Mizuno, Chihaya Adachi, Hiroyuki Kuwae, Weixin Fu, Akiko Okada
Publikováno v:
ACS applied materialsinterfaces. 9(32)
By preparing parallelly aligned 1.9-μm-high SiO2 microfluidic channels on an indium tin oxide substrate surface, the solution flow direction during spin-coating was controlled to be parallel to the grating. Using this technique, a pentafluorene–4,
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
We propose a technique for the simultaneous fabrication of a through-glass interconnect via (TGV) and Au bumps using dry filling process of submicron Au particles. First, dry film resist holes were fabricated over glass through holes by photolithogra
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
We proposed a single crystal quartz direct bonding method utilizing amorphous SiO2 intermediated layers, which can improve heat resistance of the optical low pass filter (OLPF) by novel fabrication method. An amorphous SiO2 was deposited on the oppos
Publikováno v:
Journal of Micromechanics and Microengineering. 26:105018
We propose hermetic sealing of a glass-to-glass structure with an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. The top and bottom bumps and the TGV were formed by a simple filling process with a bump-patterned