Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Huang, Guangwen"'
Publikováno v:
International Journal of Thermal Sciences. 170:107145
The ever-increasing performance of thin portable electronic products has made their heat dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra-thin vapor chamber (UTVC) with six spiral woven meshes and single-lay
Publikováno v:
Applied Thermal Engineering. 168:114889
With the rapid development of photoelectric products, their miniaturization and high integration have intensified the problem of heat dissipation. In this paper, a new type of bionic vapor chamber is designed and manufactured. The wick structure for
Publikováno v:
Applied Thermal Engineering. 167:114726
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm thick) with four spiral woven meshes and one bottom mesh composite wick
Publikováno v:
Applied Thermal Engineering. 162:114263
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, cost-effective mesh-type UTVCs (total thickness: 1.26–1.77 mm) were fabricated and investi