Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Huang, Guangwen"'
Publikováno v:
International Journal of Thermal Sciences. 170:107145
The ever-increasing performance of thin portable electronic products has made their heat dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra-thin vapor chamber (UTVC) with six spiral woven meshes and single-lay
Publikováno v:
International Journal of Heat and Mass Transfer. 176:121467
The rapid development of high-performance portable electronics requires ultra-thin heat pipes (UTHPs) with higher heat transfer capacity to meet their heat dissipation needs. Wick structure, the key component of a heat pipe, makes a decisive role in
Publikováno v:
International Journal of Heat and Mass Transfer. 148:119101
With the miniaturization and integration of portable devices, ultra-thin vapor chamber (UTVC) is required to have thinner thickness and better heat transfer performance. However, the reduction in thickness usually causes a decrease in heat transfer c