Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Stefan Mitsche"'
Autor:
Myriam Assous, S. Simic, A. Plihon, C. Hartler, Jean Charbonnier, Jörg Siegert, Werner Grogger, Stefan Mitsche, Franz Schrank, Stephane Moreau, E. Chery
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 18:313-320
Die-to-wafer interconnections such as copper pillars play a vital role in order to enable 3-D integration. This interconnection type allows increasing the density of interconnects but the occurrence of defects, especially intermetallic compounds (IMC