Zobrazeno 1 - 10
of 210
pro vyhledávání: '"Quan Lu"'
Publikováno v:
IEEE Access, Vol 11, Pp 89369-89382 (2023)
Deep face recognition models are vulnerable to adversarial samples generated by adversarial attack methods. However, current attack methods do not adequately represent the security problems of the deep FR models, because they either produce adversari
Externí odkaz:
https://doaj.org/article/b6a91c783f404e658c1c799bf06a26cb
Publikováno v:
IEEE Access, Vol 10, Pp 53418-53432 (2022)
Existing malicious device detection preprocessing ignores the topological similarity of node neighborhood structures in the network. According to the structural equivalence hypothesis, devices with approximately local symmetry in the device-account g
Externí odkaz:
https://doaj.org/article/d4fdca07c11d45ff9e1de310cffd048b
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Publikováno v:
2023 IEEE 8th International Conference on Big Data Analytics (ICBDA).
Autor:
Zichen Zhang, Shengchang Lu, Carl Nicholas, Nick Yun, Woongje Sung, Khai D.T. Ngo, Guo-Quan Lu
Publikováno v:
2022 IEEE Energy Conversion Congress and Exposition (ECCE).
Publikováno v:
2022 IEEE Electrical Insulation Conference (EIC).
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 9, Pp 966-971 (2021)
SiC MOSFET allows higher temperature capability with higher switching efficiency than that of conventional Si devices, due to its superior electrical and thermal properties. Nevertheless, there are few reports on the systematic characterization of th
Publikováno v:
2021 IEEE 21st International Conference on Communication Technology (ICCT).
Autor:
Jiayu Xu, Sreekant Narumanchi, Guo-Quan Lu, Zichen Zhang, Paul Paret, Emily Cousineau, Jiaxiang Zhang, Khai D. T. Ngo
Publikováno v:
2021 IEEE Electric Ship Technologies Symposium (ESTS).
Packaging innovations are needed for medium-voltage wide bandgap power semiconductor modules to enable their adaptation in grid applications. A unique challenge for packaging medium-voltage power modules is managing the trade-off between insulation d
Publikováno v:
2021 IEEE Applied Power Electronics Conference and Exposition (APEC).
This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal pe